Thermal cycling reliability of leadfree chip resistor solder joints article pdf available in soldering and surface mount technology 162. Solder is known to be a highly strain rate dependent. Pga socket to pcb warpage and socket flatness as a future study is reported. Since there are no lead fingers in the immediate corners of the package for the dual row design, which is typically the highest stress area of the package during testing, the overall solder joint lifetime can be increased. Reliability study of leadfree snagcu solder joints vs. A systems approach to solder joint fatigue in spacecraft. With more consumer products moving towards environmentally friendly packaging, making solder pbfree has become an urgent task for electronics assemblies. The acceleration factors were determined in calculations for solder joint reliability summary report, which is located in the same mechanical test reports section as this report. Scanning electron microscope sem testing of samples was used in order to help establish the cause. As the number of joints increase, 2 and their size decreases, the reliability of solder joints becomes an issue because they are. In this chapter, we evaluate the reliability of the produced solder joints for power chip interconnection.
Reliability assessment of preloaded solder joint under. Comparison of reliability of solder joints by form and sorm. The purpose of this study is to determine the acceptable level of au in sac305 solder joints. The high temperatures associated with ir or convection reflow solder processes are. A key production issue that is always at the forefront among electronics manufacturers is the achievement of consistently acceptable solder joint reliability. A controlchart based method for solder joint crack detection. Jet propulsion laboratory california institute of technology pasadena, ca 91109 differential expansion induced fatigue resulting from temperature cycling is a leading cause of solder joint failures in spacecraft.
Comprehensive boardlevel solder joint reliability modeling and testing of qfn and powerqfn packages article pdf available in microelectronics reliability 438. In phase ii, the correlation of solder joint reliability of. Explores failure mechanisms and includes practical methods for testing, analysis, and life prediction of solder joints subjected to conditions of fatigue, creep, stress relaxation, shock, and vibration. An acceleration model for leadfree sac solder joint reliability under thermal cycling vasu vasudevan and xuejun fan intel corporation, 5200 elam young pkwy, hillsboro, or 97124. Solder attachment reliability, accelerated testing, and result evaluation. Samples were tested using 40125c temperature cycling.
Apr 19, 2012 with more consumer products moving towards environmentally friendly packaging, making solder pbfree has become an urgent task for electronics assemblies. In phase iii, the methodology to established the residual stress under mechanical bending to the reliability scale is proposed. Three different package platforms with different au thicknesses were assembled on boards with two different au thicknesses using a standard surface mount assembly line in a realistic production environment. Solder joint reliability is defined as the ability of your products solder joints to function under given conditions and for a specified period of time without exceeding acceptable failure levels.
Effect of gold content on the reliability of snagcu solder joints. Failure analysis and design of a heavily loaded pin joint by nader farzaneh submitted to the department of mechanical engineering on march 27, 2002, in partial fulfillment of the requirements for the degree of master of science in mechanical engineering abstract. Eutectic ausn solder is increasingly used in high reliability andor high temperature applications where conventional snpb and pbfree solders exhibit insufficient strength, creep. Reliability analysis of lowag bga solder joints using four failure criteria erin a. The effect of these factors on the solder joint reliability is discussed. A systems approach to solder joint fatigue in spacecraft electronic packaging r. The article concludes with a brief discussion of materials options available to im. Identification of solder joint failures the helpline received a call from a manufacturer who had experienced solder joint reliability issues with gold plated pins in a leadfree solder.
Effect of voids on the reliability of bgacsp solder joints. Montclair, nj abstract this paper presents a quantitative analysis of solder joint reliability data for leadfree snagcu sac and mixed assembly. Mechanical shock test guidelines for solder joint reliability foreword this publication has been drafted as part of a joint working group between the ipc 610d task group and the jedec jc14. The customer requested failure analysis of goldnickel. This study is focussed on investigating the effect of voids on the reliability of solder joints. Thermal cycling test results showed that the af between 0 100c and 40125c thermal profiles is 3. Study on solder joint reliability of fine pitch csp. An overview of the solder joint reliability assessment methodology for a custom design leadfree, high performance rf package has been presented, including.
Solder joint reliability is defined as the ability of your products solder joints to function under given conditions and for a specified period of. Reliability behavior of leadfree solder joints in electronic. The objective of this study is to compare the effect of different failure criteria on the reliability life estimation. S2831 leadfree and mixed assembly solder joint reliability trends jeanpaul clech, ph. Solder joint reliability in todays competitive business environment balancing the conflicting demands of miniaturization, performance and efficiency are paramount. Addressing the issues around solder joint voids in surface mount products 1. Upon release of electronics products with leadfree pbfree solders starting in 2006 and driven by the eus rohs legislation, a few models have been in use by the electronics industry to predict. First, the current solder joint fatigue study approaches are introduced and the popular solder joint fatigue. Mroczkowski connntext associates i had the pleasure of working with dr mort antler on several occasions over the years. Failure analysis and design of a heavily loaded pin joint.
Processing and reliability issues for eutectic ausn solder joints. Looks at how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. It is intended to be used as a general guideline for mechanical drop and shock testing. Design for reliability werner engelmaier engelmaier associates, l. Design and material parameter effects on bga solderjoint. The size, location and frequency effects on the reliability were studied. In an initial study, a comparison was made between the solder joint reliabilities obtained with components fabricated with both tinlead and pure tin solder terminations. The effect of voids on the reliability of solder joint may depend not only on the size, but also on frequency and location.
Processing and reliability issues for eutectic ausn solder joints abstract eutectic ausn solder is increasingly used in high reliability andor high temperature applications where conventional snpb and pbfree solders exhibit insufficient strength, creep resistance, and other issues. Reliability assessment of preloaded solder joint under thermal cycling the ever increasing power density in modern semiconductor devices requires heat dissipation solution such as heat sink to remove heat away from the device. Reliability of solder joints assembled with leadfree solder. Study on solder joint reliability of fine pitch csp yong hill liang, hank mao, yonggang yan, jindong king lee. Most frequently when i was a member of the steering and technical committees for the holm conference on electircal contacts. Solder joint reliability national technical systems. Weibull plots comparing sac305 bga solder joint reliability to sac305 lga solder joint reliability. Design and material parameter effects on bga solderjoint reliability for automotive applications burton carpenter freescale semiconductor, inc. Addressing the issues around solder joint voids in surface. In this work, the thermal cycling reliability of several 2512 chip resistor lead free solder joint configurations has been investigated.
Mechanical shock loads, such as those experienced from dropping a cell phone for example, induce stresses at very high strain rates. Solder joint does not have adequate ductility to ensure the repeated relative displacements due to the mismatch between expansion coefficients of the chip carrier. Solder joint reliability is the ability of the interconnect to retain functionality under use environments. Processing and reliability issues for eutectic ausn solder joints dr. The reliability of a solder joint is defined as the probability that the solder joint can perform the required function under specified operating conditions for a given time interval. It was also found that solder joint reliability can be enhanced by making solder joints that have convex. Solder joint failures solder joints refer to the solder connections between a semiconductor package and the application board on which it is mounted. The most important component of system is material of solder joint, because its share in the system is about 75% and this is a big part. Pdf the state of pbfree solder a joint reliability overview. The article concludes with a brief discussion of materials options available to improve the lifetime, and hence reliability, of. Solder joint reliability of bga, csp, flip chip, and fine pitch smt assemblies lau, john h.
Association connecting electronics industries mechanical. Leadfree and mixed assembly solder joint reliability trends. Design and material parameter effects on bga solder joint reliability for automotive applications burton carpenter freescale semiconductor, inc. The effects of solder joint geometry on waferlevel chipscale package reliability have been studied both through simulations and board level reliability testing. Solder joint reliability assessment for a high performance rf.
Improving wlcsp reliability through solder joint geometry. This chapter is organized into various sections beginning with the section that lays emphasis on the need for reliability. The solder joint is part of a heterogenous dynamic system and its necessary to examine all parts of this system, when there is the requirement for high reliability. An acceleration model for leadfree sac solder joint. The selected samples were crosssectioned into the solder joints which had been identified as electrically open. Solder joint reliability solder joint reliability, or sjr, is the ability of solder joints to remain in conformance to their visualmechanical and electrical specifications over a given period of time, under a specified set of operating conditions. Solder joint reliability of bga, csp, flip chip, and fine. Processing and reliability assessment of solder joint. Failure analysis was performed on several samples after atc testing. Field mechanical stress will be monitored and fem modeling will be conducted to. Test method considerations for smt solder joint reliability. Reliability of solder joints assembled with leadfree solder vmasayuki ochiai vtoshiya akamatsu vhidefumi ueda manuscript received february 12, 2002 to protect the natural environment, we will introduce the use of leadfree solder instead of the current tinlead solder in the assembly of printed circuit boards in electronics equipment.
Solder joints are responsible for both electrical and mechanical connections. One key interest in this thesis was the use of tinlead. Pdf comprehensive boardlevel solder joint reliability. Kimura the appropriate selection of failure criterion for solder joint studies is necessary to correctly estimate reliability life. In unmounted devices, it may also refer to the packages solder connection features themselves, e. May 23, 2016 an overview of the solder joint reliability assessment methodology for a custom design leadfree, high performance rf package has been presented, including. Solder joint does not have adequate ductility to ensure the repeated relative displacements due to the mismatch between expansion coefficients of. In this paper, the effects of varying boundary conditions on the failure probability of the solder joint are studied by using the probabilistic approach methods such as the first order reliability method form and the second order reliability method sorm. Solder joint reliability is a major concern for area array technologies and power chip interconnection, thus the second objective of this study is to evaluate solder joint reliability, investigate the fatigue failure behavior of solder joint a nd improve solder joint reliability by developing a new solder bumping. Ormond beach, fl 32174 904 4378747 abstract the emerging new technologies provide ever more challenges to assure the reliability of electronic products. Solder attachment reliability, accelerated testing, and.
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